From Powder Material Processing
to Micro Application Technology

Ultra-precision medical nozzle manufacturing technology ranging from 80μm to 250μm using Micro PIM technology with LIGA process

Manufacturing of nozzles for needle-less injectors
Precision mass production of parts with ultra-fine flow paths (nozzle holes)
Implementation of harmless medical device nozzles using nickel-free eco-friendly raw materials

Micro PIM (LIGA + PIM)

Eco-friendly raw material patent

Curejet Partnership

Implementation of pressure resistance, heat resistance, and corrosion resistance responding to extreme conditions such as high pressure, high temperature, and marine environments
Custom material design according to usage environment by applying various material technologies

Stable QCDT secured through vibration molding technology
Response to complex property requirements difficult with single materials through dissimilar material bonding

Micro PM (Micro PIM + PM)

Dissimilar material bonding patent held
Tube sintering method patent application in progress

Eco-friendly ship (green ship) manufacturers

0.065T ultra-thin susceptor manufacturing technology
Heating material paste manufacturing technology
Semiconductor thick film coating technology

Pin type (Pin Type, Ceramic Type) structure response
Pipe type (Pipe Type) structure response — Outer Heater / Inner Heater
Flexible response to various heating methods and structure designs with thick film coating and thin susceptor technology
Providing customized heating solutions by product type such as pin type and pipe type

PIM

Semiconductor thick film coating technology patent in progress
2 heating method and structure patents held

KT&G

PIM

Micro LM Guide manufacturing technology based on Micro PIM (LIGA + PIM)
Ball spacing nominal dimension 1.0-5.0mm implementation possible
Response to narrow pitch enables ultra-compact and highly integrated module design

Securing mass production competitiveness for foldable and rollable devices
Increased design freedom with narrow pitch response

Micro PIM (LIGA + PIM)

LM guide patent held

LG Electronics, global companies

Micro mold manufacturing technology through LIGA process
Comprehensive response from LIGA-based micro mold manufacturing to module manufacturing and assembly

Manufacturing of gimbal, tilt rotor, and folding arm drive parts for drones and UAM
Manufacturing of gripper fingers and robot heads for robotics (excluding joints)
Manufacturing of precision drive medical and wearable in confined spaces
Manufacturing of LiDAR and sensor scanning rotation modules for autonomous driving and mobility

Micro PIM (LIGA + PIM)

Raw material patent held

Angel Robotics, global companies in medical and industrial robotics

TiC (Titanium Carbide) based hybrid material application possible
50% or more weight reduction compared to Wc
Stable workability in high temperature environment around 1000°C and bearing life improvement of 50% or more

Less wear and deformation in high temperature and high load environments
Same parts can be manufactured with less than half the weight
Carbon neutral and eco-friendly parts implementation with scrap-free process

PIM

Guide roller manufacturing technology patent held

POSCO

Technology for thermal conductivity and CTE design selection by material grade such as CPC, C-G, C-D
Manufacturing technology for heat dissipation materials by compounding Mo Alloy, Graphite, and Diamond with Cu
Manufacturing of heat dissipation parts with custom-designed thermal conductivity and thermal expansion coefficient according to requirements

Improved thermal conductivity performance compared to conventional Cu heat sinks with C-G / C-D materials
Minimize interface thermal stress by approaching CTE with Si, SiC, and GaAs chips
Provide optimal heat dissipation solution for applications and costs with material grade selection

PIM

Heat sink manufacturing method patent held
Alloy powder composition patent
Manufacturing method patent in progress

Semiconductor, solar power, heat sink manufacturers